公开(公告)号：US12083722B2

公开(公告)日：2024-09-10

申请号：US17420715

申请日：2019-12-24

申请人： MITSUBA Corporation

发明人： Takao Umezawa ,  Hitoshi Konuma ,  Mitsunori Sato

IPC分类号： B29C45/16 ,  B29C45/00 ,  B29C45/04 ,  B29C45/06 ,  B29C45/14 ,  C23C14/34 ,  C23C14/50 ,  B29L9/00 ,  B29L31/34

CPC分类号： B29C45/162 ,  B29C45/0053 ,  B29C45/0416 ,  B29C45/062 ,  B29C45/14778 ,  B29C45/1618 ,  B29C45/1635 ,  B29C45/1671 ,  C23C14/34 ,  C23C14/505 ,  B29C2045/0079 ,  B29C2045/1673 ,  B29K2995/0003 ,  B29L2009/008 ,  B29L2031/3456

摘要： The present invention achieves cost reduction by simplifying the manufacturing process for a film-formed molded product provided with a metal coating film capable of transmitting electromagnetic waves therethrough. This method for manufacturing a film-formed molded product which includes a molded product and a metal coating film covering the molded product comprises: forming the molded product between a movable mold and a fixed mold; and then forming the metal coating film which covers the molded product by a film-forming part of a second mold without taking the molded product out from between the movable mold and the fixed mold. The metal coating film is capable of transmitting electromagnetic waves therethrough as a result of generation of cracks after being formed.