- Patent Title: Beol tip-to-tip shorting and time dependent dielectric breakdown
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Application No.: US17481198Application Date: 2021-09-21
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Publication No.: US12087624B2Publication Date: 2024-09-10
- Inventor: Chanro Park , Koichi Motoyama , Kenneth Chun Kuen Cheng , Chih-Chao Yang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Randy Tejeda
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/528 ; H01L23/532
Abstract:
A dielectric layer is located on top of and in contact with a substrate. A conductive line located within the dialectic layer. A barrier layer on top of an in contact with the dielectric layer. The barrier layer is below the conductive line. A liner layer on top of and in contact with the barrier layer and below and in contact with the conductive line. A metal liner on top of and in contact with the conductive line. A capping layer on top of and in contact with the dielectric layer, the barrier layer, the liner layer, and the metal liner.
Public/Granted literature
- US20230090755A1 BEOL TIP-TO-TIP SHORTING AND TIME DEPENDENT DIELECTRIC BREAKDOWN Public/Granted day:2023-03-23
Information query
IPC分类:
