- 专利标题: Imaging apparatus and method for manufacturing imaging apparatus comprising first insulating film including upper wall located above contact plug and second insulating film including portion located above the upper wall
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申请号: US18342423申请日: 2023-06-27
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公开(公告)号: US12087789B2公开(公告)日: 2024-09-10
- 发明人: Kosaku Saeki
- 申请人: Panasonic Intellectual Property Management Co., Ltd.
- 申请人地址: JP Osaka
- 专利权人: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- 当前专利权人: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- 当前专利权人地址: JP Osaka
- 代理机构: Rimon P.C.
- 优先权: JP 20002595 2020.01.10
- 主分类号: H01L27/146
- IPC分类号: H01L27/146 ; H04N25/76 ; H04N25/75
摘要:
An imaging apparatus including a semiconductor substrate which includes a charge accumulation portion containing an impurity of a first conductivity type; a contact plug which is connected to the charge accumulation portion, contains an impurity of the first conductivity type, and is not silicide; a first insulating film which includes an upper wall located above the contact plug; and a second insulating film which includes a portion located above the upper wall. A material of the second insulating film is different from a material of the first insulating film.
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