- Patent Title: Optoelectronic semiconductor apparatus including an optoelectronic semiconductor device having a carrier with a roughened first main surface and method for manufacturing thereof
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Application No.: US17440213Application Date: 2020-03-16
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Publication No.: US12087893B2Publication Date: 2024-09-10
- Inventor: Lutz Hoeppel , Attila Molnar
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Viering, Jentschura & Partner mbB
- Agent Samuel Y. Lo
- Priority: DE 2019106931.9 2019.03.19
- International Application: PCT/EP2020/057137 2020.03.16
- International Announcement: WO2020/187847A 2020.09.24
- Date entered country: 2021-09-17
- Main IPC: H01L33/60
- IPC: H01L33/60 ; H01L33/00 ; H01L33/22 ; H01L33/62

Abstract:
An optoelectronic semiconductor device may include a carrier having a roughened first main surface and optoelectronic semiconductor chips arranged over the roughened first main surface. The combined surface area of the optoelectronic semiconductor chips is smaller than the surface area of the carrier, and a part of the roughened first main surface is arranged between adjacent optoelectronic semiconductor chips.
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