Invention Grant
- Patent Title: Electronic device package and method of manufacturing the same
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Application No.: US17151067Application Date: 2021-01-15
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Publication No.: US12094772B2Publication Date: 2024-09-17
- Inventor: Wei-Wei Liu , Huei-Siang Wong
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/00 ; H01L23/488 ; H01L23/498 ; H01L23/522
Abstract:
An electronic device package and a method for manufacturing the same are provided. The electronic device package includes a substrate, a conductive trace, a passivation layer and an upper wiring. The conductive trace is disposed over the substrate. The conductive trace includes a body portion disposed on the substrate, and a cap portion disposed on the body portion, and the cap portion is wider than the body portion. The passivation layer covers the conductive trace. The upper wiring is disposed on the passivation layer and electrically connected to the cap portion of the conductive trace through an opening of the passivation layer.
Public/Granted literature
- US20220230915A1 ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-07-21
Information query
IPC分类:
