- 专利标题: Air spacer formation with a spin-on dielectric material
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申请号: US18297831申请日: 2023-04-10
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公开(公告)号: US12094952B2公开(公告)日: 2024-09-17
- 发明人: Ting-Ting Chen , Chen-Han Wang , Keng-Chu Lin , Shuen-Shin Liang , Tsu-Hsiu Perng , Tsai-Jung Ho , Tsung-Han Ko , Tetsuji Ueno , Yahru Cheng
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- 分案原申请号: US17192134 2021.03.04
- 主分类号: H01L29/49
- IPC分类号: H01L29/49 ; H01L29/06 ; H01L29/66
摘要:
The present disclosure describes a method of forming an intermediate spacer structure between a gate structure and a source/drain (S/D) contact structure and removing a top portion of the intermediate spacer structure to form a recess. The intermediate spacer structure includes a first spacer layer, a second spacer layer, and a sacrificial spacer layer between the first spacer layer and the second spacer layer. The method further includes removing the sacrificial spacer layer to form an air gap between the first spacer layer and the second spacer layer and spinning a dielectric layer on the air gap, the first spacer layer, and the second spacer layer to fill in the recess and seal the air gap. The dielectric layer includes raw materials for a spin-on dielectric material.
公开/授权文献
- US20230242115A1 AIR SPACER FORMATION WITH A SPIN-ON DIELECTRIC MATERIAL 公开/授权日:2023-08-03
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