- 专利标题: Resistive random access memory device
-
申请号: US18232750申请日: 2023-08-10
-
公开(公告)号: US12096706B2公开(公告)日: 2024-09-17
- 发明人: Huei-Tsz Wang , Po-Shu Wang , Wei-Ming Wang
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Duane Morris LLP
- 分案原申请号: US15908601 2018.02.28
- 主分类号: H10N70/00
- IPC分类号: H10N70/00 ; H10B61/00 ; H10B63/00 ; H10N50/85 ; H10N70/20 ; H01L23/528 ; H01L23/532 ; H01L23/544 ; H10N50/80
摘要:
A memory cell includes: a first contact feature partially embedded in a first dielectric layer; a barrier layer, lining the first contact feature, that comprises a first portion disposed between the first contact feature and first dielectric layer, and a second portion disposed above the first dielectric layer; a resistive material layer disposed above the first contact feature, the resistive material layer coupled to the first contact feature through the second portion of the barrier layer; and a second contact feature embedded in a second dielectric layer above the first dielectric layer.
公开/授权文献
- US20230397512A1 NOVEL RESISTIVE RANDOM ACCESS MEMORY DEVICE 公开/授权日:2023-12-07
信息查询