Invention Grant
- Patent Title: Forming variable depth structures with laser ablation
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Application No.: US18305256Application Date: 2023-04-21
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Publication No.: US12099241B2Publication Date: 2024-09-24
- Inventor: Peter Kurunczi , Joseph C. Olson , Morgan Evans , Rutger Meyer Timmerman Thijssen
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan LLP
- Main IPC: G02B6/34
- IPC: G02B6/34 ; G03F7/00 ; G03F7/09 ; B29C33/38
Abstract:
A method for forming a device structure is disclosed. The method of forming a device structure includes forming a variable-depth structure in a device material layer using a laser ablation. A plurality of device structures is formed in the variable-depth structure to define slanted device structures therein. The variable-depth structure and the slanted device structures are formed using an etch process.
Public/Granted literature
- US20230251430A1 FORMING VARIABLE DEPTH STRUCTURES WITH LASER ABLATION Public/Granted day:2023-08-10
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