Invention Grant
- Patent Title: Semiconductor package structure
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Application No.: US17185499Application Date: 2021-02-25
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Publication No.: US12100697B2Publication Date: 2024-09-24
- Inventor: Chang-Yu Lin , Cheng-Hsuan Wu
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; G02B6/42 ; H01L21/78 ; H01L23/00 ; H01L23/31 ; H01L23/52 ; H01L25/16
Abstract:
A semiconductor package structure and a method of manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first electronic device and a second electronic device. The first electronic device has an active surface and a lateral surface angled with the active surface, and the lateral surface includes a first portion and a second portion that is non-coplanar with the first portion. The second electronic device is disposed on the active surface of the first electronic device.
Public/Granted literature
- US20220271019A1 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-08-25
Information query
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