- 专利标题: Gate-all-around field effect transistor with bottom dielectric isolation
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申请号: US17518515申请日: 2021-11-03
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公开(公告)号: US12100746B2公开(公告)日: 2024-09-24
- 发明人: Julien Frougier , Nicolas Loubet , Andrew M. Greene , Ruilong Xie , Maruf Amin Bhuiyan , Veeraraghavan S. Basker
- 申请人: International Business Machines Corporation
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理商 David K. Mattheis
- 主分类号: H01L29/423
- IPC分类号: H01L29/423 ; H01L29/06 ; H01L29/66
摘要:
A semiconductor device includes a semiconductor substrate, a first pair of FET (field effect transistor) gate structures separated by a first gate canyon having a first gate canyon spacing, disposed upon the semiconductor substrate, a second pair of FET gate structures separated by a second gate canyon having a second gate canyon spacing, disposed upon the substrate, a first S/D (source/drain region disposed in the first gate canyon, a second S/D region disposed in the second gate canyon, a first BDI (bottom dielectric isolation) element disposed below the first S/D region and having a first BDI thickness, and a second BDI element disposed below the second S/D region and having a second BDI thickness. The first BDI thickness exceeds the second BDI thickness.
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