Invention Grant
- Patent Title: Haptic stimulation systems and methods
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Application No.: US17373380Application Date: 2021-07-12
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Publication No.: US12105877B2Publication Date: 2024-10-01
- Inventor: Jun Xu , Fei Liu
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Conley Rose, P.C.
- Main IPC: G06F3/01
- IPC: G06F3/01 ; G06F3/03 ; G10L21/10 ; G10L21/16

Abstract:
The disclosure relates to technology for haptic stimulation. According to one aspect of the present disclosure, there is provided a haptic stimulation system comprising a haptic stimulation interface comprising a pattern of stimulation elements configured to stimulate receptors in skin of a user. The haptic stimulation system further comprises a control circuit configured to present information in the haptic stimulation interface in accordance with a presentation mode that is tailored to the user.
Public/Granted literature
- US20210342007A1 Haptic Simulation Systems and Methods Public/Granted day:2021-11-04
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