Invention Grant
- Patent Title: Wiring board and method for manufacturing wiring board
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Application No.: US18200712Application Date: 2023-05-23
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Publication No.: US12107327B2Publication Date: 2024-10-01
- Inventor: Koichi Suzuki , Seiji Take , Daisuke Matsuura
- Applicant: DAI NIPPON PRINTING CO., LTD.
- Applicant Address: JP Tokyo-to
- Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP 17229272 2017.11.29 JP 18045941 2018.03.13 JP 18053281 2018.03.20
- The original application number of the division: US16768254
- Main IPC: H05K1/02
- IPC: H05K1/02 ; G01J5/02 ; G01J5/20 ; G01J5/22 ; G01J5/24 ; G02F1/13 ; H01Q1/36 ; H01Q1/38 ; H01Q1/40 ; H01Q1/44 ; H01Q3/02 ; H01Q3/24 ; H01Q3/26 ; H01Q3/34 ; H01Q7/00 ; H01Q21/06 ; H01Q21/12 ; H05K3/10 ; H05K3/18

Abstract:
A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.
Public/Granted literature
- US20230369751A1 WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD Public/Granted day:2023-11-16
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