Invention Grant
- Patent Title: Microelectronic structures including bridges
-
Application No.: US17126502Application Date: 2020-12-18
-
Publication No.: US12113023B2Publication Date: 2024-10-08
- Inventor: Omkar G. Karhade , Nitin A. Deshpande
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Akona IP PC
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H01L23/00 ; H01L23/538 ; H01L25/065
Abstract:
Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.
Public/Granted literature
- US20220199539A1 MICROELECTRONIC STRUCTURES INCLUDING BRIDGES Public/Granted day:2022-06-23
Information query
IPC分类:
