Invention Grant
- Patent Title: Low pressure sintering powder
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Application No.: US17245397Application Date: 2021-04-30
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Publication No.: US12113039B2Publication Date: 2024-10-08
- Inventor: Shamik Ghoshal , Nirmalya Kumar Chaki , Poulami Sengupta Roy , Siuli Sarkar , Anubhav Rustogi
- Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
- Applicant Address: US NJ South Plainfield
- Assignee: Alpha Assembly Solutions Inc.
- Current Assignee: Alpha Assembly Solutions Inc.
- Current Assignee Address: US CT Waterbury
- Agency: Stinson LLP
- Priority: IN 23DEL2014 2014.04.11
- Main IPC: H01L23/00
- IPC: H01L23/00 ; B22F1/052 ; B22F1/102 ; B22F1/107 ; B22F1/17 ; B22F7/04 ; B23K1/00 ; B23K35/02 ; B23K35/30 ; B23K35/36 ; B23K35/365 ; B23K101/40 ; B23K103/00 ; H01B1/22 ; H01L25/00 ; H05K3/32 ; H10K50/842
Abstract:
A sintering powder comprising:
a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.
a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.
Public/Granted literature
- US20210249376A1 LOW PRESSURE SINTERING POWDER Public/Granted day:2021-08-12
Information query
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