A method for manufacturing a double-sided wiring circuit board includes a first step of preparing a laminate and a second step. The laminate includes a metal core layer, insulating layers, and conductor layers. The insulating layer has a region and an opening that are adjacent to each other. The insulating layer has a region including a part facing the region in a thickness direction, and an opening adjacent to the region. The conductor layer includes a wiring portion and a conductive portion. In the second step, the first and second etching treatments for etching the metal core layer through the openings are carried out to form a via portion having a periphery surrounded by a space, extending between the regions, and connected to the conductive portions.