公开(公告)号：US12137522B2

公开(公告)日：2024-11-05

申请号：US17783537

申请日：2020-12-15

Applicant: NITTO DENKO CORPORATION

Inventor： Rihito Fukushima ,  Shusaku Shibata ,  Teppei Niino

IPC: H05K1/05 ,  H05K1/09 ,  H05K1/18 ,  H05K3/32

Abstract: A wiring circuit board includes a mounting region for mounting an electronic element and a circuit region surrounding the mounting region. The mounting region includes a terminal. The circuit region includes a circuit to be electrically connected to the terminal. The circuit region includes a metal support layer, a base insulating layer, and a conductive layer including the circuit. The mounting region does not include the metal support layer and includes a base insulating layer having an opening portion, and the conductive layer including the terminal. The terminal is disposed in the opening portion of the base insulating layer.

公开(公告)号：US12114438B2

公开(公告)日：2024-10-08

申请号：US17783546

申请日：2020-11-12

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku Shibata ,  Rihito Fukushima ,  Teppei Niino

IPC: H05K3/40 ,  H05K1/02 ,  H05K1/05 ,  H05K1/11 ,  H05K3/44 ,  H05K3/46

CPC classification number: H05K3/4084 ,  H05K1/0298 ,  H05K1/05 ,  H05K1/116 ,  H05K3/445 ,  H05K3/4647 ,  H05K2203/0323 ,  H05K2203/1484

Abstract: A method for manufacturing a double-sided wiring circuit board includes a first step of preparing a laminate and a second step. The laminate includes a metal core layer, insulating layers, and conductor layers. The insulating layer has a region and an opening that are adjacent to each other. The insulating layer has a region including a part facing the region in a thickness direction, and an opening adjacent to the region. The conductor layer includes a wiring portion and a conductive portion. In the second step, the first and second etching treatments for etching the metal core layer through the openings are carried out to form a via portion having a periphery surrounded by a space, extending between the regions, and connected to the conductive portions.

公开(公告)号：US20230141402A1

公开(公告)日：2023-05-11

申请号：US18054014

申请日：2022-11-09

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku Shibata ,  Teppei Niino ,  Yosuke Nakanishi

IPC: H05K1/02

CPC classification number: H05K1/0296

Abstract: Provided is a wiring circuit board that includes a first insulating layer, a conductive pattern disposed on the first insulating layer, and a second protective layer disposed between the first insulating layer and protecting the conductive pattern. The second protective layer consists of a metal oxide.

公开(公告)号：US12284757B2

公开(公告)日：2025-04-22

申请号：US17908470

申请日：2021-02-24

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku Shibata ,  Hiroaki Machitani ,  Teppei Niino

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/05 ,  H05K3/32 ,  H05K3/46 ,  H05K1/18

Abstract: A wiring circuit board includes two insulating layers, a wiring layer, a pad portion, and a conductive connection portion. The wiring layer is on one side in a thickness direction of the first insulating layer, and has a contact portion. The second insulating layer is on one side in the thickness direction of the first insulating layer to cover the wiring layer. The pad portion is on one side in the thickness direction of the second insulating layer. The second insulating layer has a through opening portion and having an opening along at least a part of a peripheral end portion of the pad portion. The contact portion of the wiring layer faces the through opening portion. The conductive connection portion, is connected to at least the peripheral end portion of the pad portion, and the contact portion, and electrically connects the wiring layer to the pad portion.

公开(公告)号：US12238859B2

公开(公告)日：2025-02-25

申请号：US18054029

申请日：2022-11-09

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku Shibata ,  Teppei Niino ,  Yosuke Nakanishi

IPC: H05K1/02 ,  H05K1/05 ,  H05K1/09 ,  H05K3/24 ,  H05K3/28

Abstract: Provided is a wiring circuit board that includes a first insulating layer, a conductive pattern disposed on the first insulating layer, a second insulating layer disposed on the first insulating layer and covering the conductive pattern, and a third protective layer disposed between the conductive pattern and the second insulating layer and protecting the conductive pattern. The third protective layer consists of a metal oxide.

公开(公告)号：US12238858B2

公开(公告)日：2025-02-25

申请号：US18054014

申请日：2022-11-09

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku Shibata ,  Teppei Niino ,  Yosuke Nakanishi

IPC: H05K1/02

Abstract: Provided is a wiring circuit board that includes a first insulating layer, a conductive pattern disposed on the first insulating layer, and a second protective layer disposed between the first insulating layer and protecting the conductive pattern. The second protective layer consists of a metal oxide.

公开(公告)号：US12120829B2

公开(公告)日：2024-10-15

申请号：US17913055

申请日：2021-03-05

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku Shibata ,  Shun Shiga ,  Teppei Niino

IPC: H05K3/00 ,  H05K1/11 ,  H05K3/28 ,  H05K3/46

CPC classification number: H05K3/0097 ,  H05K1/118 ,  H05K3/28 ,  H05K3/4608 ,  H05K2203/1545 ,  H05K2203/308

Abstract: An assembly sheet as a wiring circuit board assembly sheet includes a metal substrate, a wiring circuit structure portion, and a dummy structure portion. The metal substrate includes a product region and a frame region adjacent thereto. The wiring circuit structure portion is disposed on one surface in a thickness direction of the metal substrate in the product region, and includes a terminal portion. The dummy structure portion is disposed on one surface in the thickness direction of the metal substrate in the frame region, includes a plurality of conductive layers aligned in the thickness direction, and has a greater height above the metal substrate than the terminal portion.