- 专利标题: Unfused thermal support area in 3D fabrication systems
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申请号: US18139460申请日: 2023-04-26
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公开(公告)号: US12115733B2公开(公告)日: 2024-10-15
- 发明人: Wei Huang , Gary J. Dispoto
- 申请人: Hewlett-Packard Development Company, L.P.
- 申请人地址: US TX Spring
- 专利权人: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- 当前专利权人: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- 当前专利权人地址: US TX Spring
- 代理机构: Shook, Hardy & Bacon L.L.P.
- 分案原申请号: US16607379
- 主分类号: B29C64/40
- IPC分类号: B29C64/40 ; B29C64/165 ; B29C64/393 ; B33Y10/00 ; B33Y30/00 ; B33Y50/02
摘要:
According to examples, a three-dimensional (3D) fabrication system may include a controller that may control an agent delivery system to deposit a fusing agent onto a fusing area of a layer of particles of build material. The controller may also control the agent delivery system to deposit an energy absorbing agent onto an unfused thermal support area of the layer of particles, the unfused thermal support area being located adjacent to the fusing area. The controller may further control an energy supply system to supply energy, in which supply of the energy is to cause the particles on which the fusing agent has been deposited to melt and a temperature of the particles in the unfused thermal support area to be raised to a level that is below a melting point temperature of the particles.
公开/授权文献
- US20230356474A1 UNFUSED THERMAL SUPPORT AREA IN 3D FABRICATION SYSTEMS 公开/授权日:2023-11-09
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