发明授权
- 专利标题： Sacrificial protection layer for environmentally sensitive surfaces of substrates
-
申请号： US17310303申请日： 2020-01-28
-
公开(公告)号： US12119218B2公开(公告)日： 2024-10-15
- 发明人: Stephen M. Sirard , Ratchana Limary , Yang Pan , Diane Hymes
- 申请人： Lam Research Corporation
- 申请人地址： US CA Fremont
- 专利权人： Lam Research Corporation
- 当前专利权人： Lam Research Corporation
- 当前专利权人地址： US CA Fremont
- 代理机构： Weaver Austin Villeneuve & Sampson LLP
- 国际申请： PCT/US2020/015451 2020.01.28
- 国际公布： WO2020/160016A 2020.08.06
- 进入国家日期： 2021-07-27
- 主分类号： H01L21/02
- IPC分类号： H01L21/02 ; H01L21/306 ; H01L21/67
摘要：
A method for protecting a surface of a substrate during processing includes a) providing a solution forming a co-polymer having a ceiling temperature; b) dispensing the solution onto a surface of the substrate to form a sacrificial protective layer, wherein the co-polymer is kinetically trapped to allow storage at a temperature above the ceiling temperature; c) exposing the substrate to ambient conditions for a predetermined period; and d) de-polymerizing the sacrificial protective layer by using stimuli selected from a group consisting of ultraviolet (UV) light and heat.
公开/授权文献
信息查询
IPC分类:
