公开(公告)号：US12126126B2

公开(公告)日：2024-10-22

申请号：US17569079

申请日：2022-01-05

申请人： Aptiv Technologies AG

发明人： M. Jarod Scherer ,  Stefanie Merry ,  Tyler Folger

IPC分类号： H01R24/00 ,  H01Q1/12 ,  H01Q1/24 ,  H01R24/50 ,  H01R43/20 ,  H05K1/14 ,  H05K1/18 ,  H05K5/00 ,  H01R12/52 ,  H01R12/55

CPC分类号： H01R24/50 ,  H01Q1/1271 ,  H01Q1/24 ,  H01R43/205 ,  H05K1/147 ,  H05K1/18 ,  H05K5/0034 ,  H05K5/0069 ,  H01R12/52 ,  H01R12/55 ,  H05K2201/10098 ,  H05K2201/10189 ,  H05K2201/10356

摘要： An electronic assembly includes a circuit board having a plurality of conductive traces and electronic components forming an electronic circuit disposed thereon, a plurality of flexible electrical terminals configured to attach to electrical contacts disposed on a glass surface and electrically connected to the plurality of conductive traces, and a coaxial cable connector electrically connected to the plurality of conductive traces. A method of manufacturing an electronic assembly, e.g., the electronic assembly described above, is also presented herein.