The present disclosure discloses a vibration transducer including a circuit board enclosing a receiving cavity, a MEMS chip, a first vibration unit having a first vibration cavity and a second vibration unit having a second vibration cavity. A first through hole provided on the circuit board is configured to connect the receiving cavity with the first vibration cavity; a second through hole provided on the circuit board is configured to connect the receiving cavity with the second vibration cavity. The first vibration unit vibrates to cause pressure change in the first vibration cavity which is transmitted to the MEMS chip through the first through hole; the second vibration unit vibrates to cause pressure change in the second vibration cavity which is transmitted to the MEMS chip through the second through hole. The vibration transducer in the present disclosure has higher sensitivity and SNR.