- 专利标题: Pillar-shaped semiconductor device and method for producing the same
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申请号: US17565738申请日: 2021-12-30
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公开(公告)号: US12127385B2公开(公告)日: 2024-10-22
- 发明人: Fujio Masuoka , Nozomu Harada
- 申请人: Unisantis Electronics Singapore Pte. Ltd.
- 申请人地址: SG Singapore
- 专利权人: UNISANTIS ELECTRONICS SINGAPORE PTE. LTD.
- 当前专利权人: UNISANTIS ELECTRONICS SINGAPORE PTE. LTD.
- 当前专利权人地址: SG Singapore
- 代理机构: Crowell & Moring LLP
- 主分类号: H01L21/768
- IPC分类号: H01L21/768 ; H01L29/423 ; H01L29/66 ; H01L29/78 ; H10B10/00 ; H01L21/311
摘要:
In formation of an SRAM cell, a band-shaped contact hole C3 is formed that does not overlap, in plan view. N+ layers 32a, 32c, 32d, and 32f formed on and at outer peripheries of the top portions of Si pillars 6a, 6c, 6d, and 6f, that partly overlaps W layers 33b and 33e on P+ layers 32b and 32e connected to the top portions of Si pillars 6b and 6e, that is connected in both the X direction and the Y direction, and that extends in the Y direction. A power supply wiring metal layer Vdd that connects the P+ layers 32b and 32e through the contact hole C3 is formed. After formation of the power supply wiring metal layer Vdd, a word wiring metal layer WL is formed so as to be orthogonal to the power supply wiring metal layer Vdd in plan view.
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