Invention Grant
- Patent Title: Semiconductor device including separation pattern penetrating gate structure and method of fabricating the same
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Application No.: US17466043Application Date: 2021-09-03
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Publication No.: US12132046B2Publication Date: 2024-10-29
- Inventor: Ho-Jun Kim , Beomjin Park , Dong Il Bae , Mirco Cantoro
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20210020472 2021.02.16
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/417 ; H01L29/423

Abstract:
Disclosed are semiconductor devices and methods of fabricating the same. The semiconductor device includes a plurality of gate structures that are spaced apart from each other in a first direction on a substrate and extend in a second direction intersecting the first direction, and a plurality of separation patterns penetrating immediately neighboring ones of the plurality of gate structures, respectively. Each of the plurality of separation patterns separates a corresponding one of the neighboring gate structures into a pair of gate structures that are spaced apart from each other in the second direction. The plurality of separation patterns are spaced apart from and aligned with each other along the first direction.
Public/Granted literature
- US20220262790A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2022-08-18
Information query
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