Semiconductor device
    1.
    发明授权

    公开(公告)号:US11569349B2

    公开(公告)日:2023-01-31

    申请号:US17333080

    申请日:2021-05-28

    Abstract: A semiconductor device includes first and second active patterns, a field insulating film between the first and second active patterns, a first gate structure intersecting the first active pattern and including a first gate electrode and a first gate spacer, a second gate structure intersecting the second active pattern and including a second gate electrode and a second gate spacer, a gate separation structure on the field insulating film between the first and second gate structures, the gate separation structure including a gate separation filling film on a gate separation liner, and a connecting spacer between the gate separation structure and the field insulating film, the connecting spacer protruding from a top surface of the field insulating film, and the gate separation liner contacting the connecting spacer and extending along a top surface and sidewalls of the connecting spacer and along the top surface of the field insulating film.

    SEMICONDUCTOR MEMORY DEVICE
    2.
    发明申请

    公开(公告)号:US20210257369A1

    公开(公告)日:2021-08-19

    申请号:US17313570

    申请日:2021-05-06

    Abstract: A semiconductor device includes a substrate, a peripheral circuit layer, a first active pattern, a gate electrode, a first insulating layer, a conductive contact, and a second active pattern. The peripheral circuit layer is disposed on the substrate, and the peripheral circuit layer includes logic transistors and an interconnection layer that is disposed on the logic transistors. The first active pattern is disposed on the peripheral circuit layer. The gate electrode is disposed on a channel region of the first active pattern. The first insulating layer is disposed on the first active pattern and the gate electrode. The conductive contact is disposed in the first insulating layer and is electrically connected to a first source/drain region of the first active pattern, and the second active pattern is disposed on the first insulating layer. The channel region of the second active pattern vertically overlaps with the conductive contact.

    Method for manufacturing a semiconductor device

    公开(公告)号:US11955516B2

    公开(公告)日:2024-04-09

    申请号:US18102204

    申请日:2023-01-27

    CPC classification number: H01L29/0673 H01L21/823481 H01L29/4236 H01L29/6656

    Abstract: A semiconductor device includes first and second active patterns, a field insulating film between the first and second active patterns, a first gate structure intersecting the first active pattern and including a first gate electrode and a first gate spacer, a second gate structure intersecting the second active pattern and including a second gate electrode and a second gate spacer, a gate separation structure on the field insulating film between the first and second gate structures, the gate separation structure including a gate separation filling film on a gate separation liner, and a connecting spacer between the gate separation structure and the field insulating film, the connecting spacer protruding from a top surface of the field insulating film, and the gate separation liner contacting the connecting spacer and extending along a top surface and sidewalls of the connecting spacer and along the top surface of the field insulating film.

    Integrated circuit devices
    10.
    发明授权

    公开(公告)号:US10361319B2

    公开(公告)日:2019-07-23

    申请号:US15981578

    申请日:2018-05-16

    Abstract: An integrated circuit device includes a substrate, first and second fin active regions formed on the substrate and extending in a first direction parallel to a top surface of the substrate, a first gate structure disposed on a side surface of the first fin active region, a pair of first impurity regions respectively formed on a top portion and a bottom portion of the first fin active region, a second gate structure disposed on a side surface of the second fin active region, and a pair of second impurity regions respectively formed on a top portion or a bottom portion of the second fin active region, wherein the pair of first impurity regions vertically overlap each other, and the pair of second impurity regions do not vertically overlap each other.

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