Invention Grant
- Patent Title: Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agent
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Application No.: US17995186Application Date: 2021-03-24
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Publication No.: US12134834B2Publication Date: 2024-11-05
- Inventor: Marco Arnold , Alexander Fluegel , Charlotte Emnet , Nadine Engelhardt
- Applicant: BASF SE
- Applicant Address: DE Ludwigshafen am Rhein
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen am Rhein
- Agency: Armstrong Teasdale LLP
- Priority: EP20168057 20200403
- International Application: PCT/EP2021/057522 WO 20210324
- International Announcement: WO2021/197950 WO 20211007
- Main IPC: C25D3/38
- IPC: C25D3/38
Abstract:
Described herein is a composition including copper ions, an acid, and at least one polyaminoamide including, a group of formula L1 [A-B-A′-Z]n[Y—Z]m (L1) where B is a diacid fragment of formula L2 A, A′ are amine fragments independently selected from the group consisting of formula L3a and formula L3b Y is a co-monomer fragment; Z is a coupling fragment of formula L4 n is an integer of from 1 to 400; and m is 0 or an integer of from 1 to 400.
Public/Granted literature
- US20230142238A1 COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A POLYAMINOAMIDE TYPE LEVELING AGENT Public/Granted day:2023-05-11
Information query
