Invention Publication
- Patent Title: COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A POLYAMINOAMIDE TYPE LEVELING AGENT
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Application No.: US17995186Application Date: 2021-03-24
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Publication No.: US20230142238A1Publication Date: 2023-05-11
- Inventor: Marco ARNOLD , Alexander FLUEGEL , Charlotte EMNET , Nadine ENGELHARDT
- Applicant: BASF SE
- Applicant Address: DE Ludwigshafen am Rhein
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen am Rhein
- Priority: WO 168057.6 2020.04.03
- International Application: PCT/EP2021/057522 2021.03.24
- Date entered country: 2022-09-30
- Main IPC: C25D3/38
- IPC: C25D3/38
Abstract:
Described herein is a composition including copper ions, an acid, and at least one polyaminoamide including, a group of formula L1
[A-B-A′-Z]n[Y—Z]m (L1)
where
B is a diacid fragment of formula L2
A, A′ are amine fragments independently selected from the group consisting of formula L3a
and formula L3b
Y is a co-monomer fragment;
Z is a coupling fragment of formula L4
n is an integer of from 1 to 400; and
m is 0 or an integer of from 1 to 400.
[A-B-A′-Z]n[Y—Z]m (L1)
where
B is a diacid fragment of formula L2
A, A′ are amine fragments independently selected from the group consisting of formula L3a
and formula L3b
Y is a co-monomer fragment;
Z is a coupling fragment of formula L4
n is an integer of from 1 to 400; and
m is 0 or an integer of from 1 to 400.
Public/Granted literature
- US12134834B2 Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agent Public/Granted day:2024-11-05
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