Invention Grant
- Patent Title: System of S-shaped conduit mounting assembly hooks
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Application No.: US18213829Application Date: 2023-06-24
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Publication No.: US12146514B2Publication Date: 2024-11-19
- Inventor: Christopher Lewis
- Applicant: Wencon Development, Inc.
- Applicant Address: US CA Walnut Creek
- Assignee: Wencon Development, Inc.
- Current Assignee: Wencon Development, Inc.
- Current Assignee Address: US CA Walnut Creek
- Agency: Temmerman Law
- Agent Mathew J. Temmerman
- Main IPC: F16B2/06
- IPC: F16B2/06 ; F16L3/12 ; F16L3/123 ; F16L3/137 ; H02S20/23 ; H02S30/20 ; F16B5/06 ; F16L3/10 ; F16L3/223 ; F16L3/237

Abstract:
A method and assembly for mounting a conduit on a mounting surface utilizing a conduit mounting assembly. The conduit mounting assembly includes a first clamp portion, a second clamp portion, a connecting screw and a conduit securement screw. The method includes providing the conduit mounting assembly, mounting the first clamp portion on a tile, mounting the second clamp portion opposite to the first clamp portion on the tile, connecting the first clamp portion with the second clamp portion utilizing the connecting screw and mounting the conduit on the second clamp portion utilizing the conduit securement screw and a conduit fastening member.
Public/Granted literature
- US20230332632A1 SYSTEM OF S-SHAPED CONDUIT MOUNTING ASSEMBLY HOOKS Public/Granted day:2023-10-19
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