- Patent Title: Flip flop and design method for integrated circuit including same
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Application No.: US18352171Application Date: 2023-07-13
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Publication No.: US12149249B2Publication Date: 2024-11-19
- Inventor: Ahreum Kim , Youngo Lee , Minsu Kim , Eunhee Choi
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Fish & Richardson P.C.
- Priority: KR10-2021-0046098 20210408
- Main IPC: H03K3/00
- IPC: H03K3/00 ; G06F30/392 ; H03K3/0233 ; H03K3/037 ; H03K17/687 ; H03K19/094 ; H03K19/20
Abstract:
A flip-flop includes a first master latch in a first row, a second master latch in a second row, a first slave latch in the first row, and a second slave latch in the second row. The first master latch and the second master latch are adjacently disposed in the second direction, and the first slave latch and the second slave latch are adjacently disposed in the second direction.
Public/Granted literature
- US20230361760A1 FLIP FLOP AND DESIGN METHOD FOR INTEGRATED CIRCUIT INCLUDING SAME Public/Granted day:2023-11-09
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