Invention Grant
- Patent Title: Coating apparatus and coating method
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Application No.: US18218457Application Date: 2023-07-05
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Publication No.: US12151255B2Publication Date: 2024-11-26
- Inventor: Hideki Kajiwara , Yuya Yonemitsu , Shinichiro Yamanaka , Shinichi Mizushino , Naruaki Iida , Kohei Kawakami , Tohru Azuma
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JP2019-18972 20200610
- Main IPC: B05B12/04
- IPC: B05B12/04 ; B05B7/00

Abstract:
An apparatus includes substrate holders each configured to hold a substrate, a first nozzle provided for each substrate holder and for discharging a first processing liquid to the substrate at a first position, a second nozzle provided to be shared by the substrate holders and for discharging a second processing liquid to the substrate at a second position, a third nozzle provided for each substrate holder and for discharging a third processing liquid to the substrate at a third position while the first and second processing liquids are not supplied to the substrate, first to third standby parts for respectively allowing the first to third nozzles to wait outside a substrate holding region, a turning mechanism for turning the first nozzle between the first standby part and the first position, and a linear motion mechanism for linearly moving the third nozzle between the third standby part and the third position.
Public/Granted literature
- US20230347369A1 COATING APPARATUS AND COATING METHOD Public/Granted day:2023-11-02
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