Invention Grant
- Patent Title: Lateral double-diffused metal oxide semiconductor device and manufacturing method thereof, and electronic apparatus
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Application No.: US17639359Application Date: 2020-05-26
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Publication No.: US12154983B2Publication Date: 2024-11-26
- Inventor: Nailong He
- Applicant: CSMC TECHNOLOGIES FAB2 CO., LTD.
- Applicant Address: CN Wuxi
- Assignee: CSMC TECHNOLOGIES FAB2 CO., LTD.
- Current Assignee: CSMC TECHNOLOGIES FAB2 CO., LTD.
- Current Assignee Address: CN Wuxi
- Agency: Dority & Manning, P.A.
- Priority: CN201910884490.9 20190919
- International Application: PCT/CN2020/092201 WO 20200526
- International Announcement: WO2021/051853 WO 20210325
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/265 ; H01L21/266 ; H01L29/66

Abstract:
The present disclosure provides a lateral double-diffused metal oxide semiconductor device and a manufacturing method thereof, and an electronic apparatus. The method includes: providing a semiconductor substrate, and forming a drift region and a body region in the semiconductor substrate; forming a drain region in the drift region, forming a source region in the body region, and forming, on the body region, a gate structure extending to the drift region; implanting ions of a first type, so as to form, at a bottom of the drift region, first ion implantation regions extending along a direction from the gate structure to the drain region; forming, above the first ion implantation regions, a plurality of mutually spaced deep trench structures and fin structures between adjacent ones of the deep trench structures; and implanting ions of a second type in the deep trench structures to form second ion implantation regions.
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