Invention Grant
- Patent Title: Integrated circuit including spacer structure for transistors
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Application No.: US17581784Application Date: 2022-01-21
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Publication No.: US12159912B2Publication Date: 2024-12-03
- Inventor: Chia-Hao Chang , Jia-Chuan You , Chu-Yuan Hsu , Kuo-Cheng Chiang , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Seed IP Law Group LLP
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L21/8234 ; H01L27/088 ; H01L29/06 ; H01L29/423 ; H01L29/66 ; H01L29/786

Abstract:
An integrated circuit includes a nanosheet transistor having a plurality of stacked channels, a gate electrode surrounding the stacked channels, a source/drain region, and a source/drain contact. The integrated circuit includes a first dielectric layer between the gate metal and the source/drain contact, a second dielectric layer on the first dielectric layer, and a cap metal on the first gate metal and on a hybrid fin structure. The second dielectric layer is on the hybrid fin structure between the cap metal and the source/drain contact.
Public/Granted literature
- US20230009738A1 INTEGRATED CIRCUIT INCLUDING SPACER STRUCTURE FOR TRANSISTORS Public/Granted day:2023-01-12
Information query
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