Invention Grant
- Patent Title: Semiconductor devices including epitaxial patterns with plurality of fin-shaped patterns
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Application No.: US17216903Application Date: 2021-03-30
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Publication No.: US12166093B2Publication Date: 2024-12-10
- Inventor: Sun Ki Min , Chae Ho Na , Sang Koo Kang , Ik Soo Kim , Dong Hyun Roh
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR10-2020-0109994 20200831
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L23/535 ; H01L27/092 ; H01L29/423 ; H01L29/786

Abstract:
A semiconductor device may include first and second fin-shaped patterns on a substrate, that extend in a first direction, and are spaced apart from each other in a second direction. A first epitaxial pattern may be on the first fin-shaped pattern, and a second epitaxial pattern may be on the second fin-shaped pattern. A field insulating layer may be on the substrate, and may cover a sidewall of the first fin-shaped pattern, a sidewall of the second fin-shaped pattern, a part of a sidewall of the first epitaxial pattern, and a part of a sidewall of the second epitaxial pattern. The top surface of the field insulating layer may be higher than the bottom surface of the first epitaxial pattern and the bottom surface of the second epitaxial pattern.
Public/Granted literature
- US20220069092A1 SEMICONDUCTOR DEVICES Public/Granted day:2022-03-03
Information query
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