Invention Grant
- Patent Title: High voltage device with linearizing field plate configuration
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Application No.: US18065768Application Date: 2022-12-14
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Publication No.: US12166476B2Publication Date: 2024-12-10
- Inventor: Santosh Sharma , Johnatan Avraham Kantarovsky , Rajendran Krishnasamy
- Applicant: GlobalFoundries U.S. Inc.
- Applicant Address: US NY Malta
- Assignee: GlobalFoundries U.S. Inc.
- Current Assignee: GlobalFoundries U.S. Inc.
- Current Assignee Address: US NY Malta
- Agency: Hoffman Warnick LLC
- Agent Francois Pagette
- Main IPC: H03K17/08
- IPC: H03K17/08 ; H01L29/40 ; H01L29/78

Abstract:
An integrated circuit (IC) having a high voltage semiconductor device with a plurality of field plates between the gate and drain. The IC further includes a biasing circuit electrically coupled to each of the plurality of field plates, the biasing circuit including a plurality of high voltage depletion mode transistors, each having a pinch off voltage. The high voltage depletion mode transistors may have different pinch off voltages, and each of the field plates are each independently biased by a different one of the high voltage depletion mode transistors.
Public/Granted literature
- US20240204764A1 HIGH VOLTAGE DEVICE WITH LINEARIZING FIELD PLATE CONFIGURATION Public/Granted day:2024-06-20
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