Invention Grant
- Patent Title: Resistive memory
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Application No.: US17574422Application Date: 2022-01-12
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Publication No.: US12185554B2Publication Date: 2024-12-31
- Inventor: Yasuhiro Tomita , Chi Shun Lin
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: MUNCY, GEISSLER, OLDS & LOWE, P.C.
- Priority: JP2018-188003 20181003
- Main IPC: H10B63/00
- IPC: H10B63/00 ; G11C13/00 ; H01L23/522 ; H01L23/528 ; H10N70/00

Abstract:
The invention provides a resistive memory with better area efficiency without degrading reliability, which includes an array area, word lines, a local source line, bit lines, and a shared source line. In the array area, memory cells are arranged in a matrix, and each memory cells includes a variable resistance element and an accessing transistor. The word lines extend in a row direction of the array area and are connected to the memory cells in the row direction. The local source line extends in a column direction of the array area. The bit lines extend in the column direction and are connected to first electrodes of the memory cells in the column direction. The shared source line is connected to the local source line. The shared source line extends in the row direction and is connected to second electrodes of the memory cells in the row direction.
Public/Granted literature
- US20220140004A1 RESISTIVE MEMORY Public/Granted day:2022-05-05
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