Invention Grant
- Patent Title: Semiconductor device, semiconductor package and method of manufacturing the same
-
Application No.: US17726363Application Date: 2022-04-21
-
Publication No.: US12199056B2Publication Date: 2025-01-14
- Inventor: Jumyong Park , Unbyoung Kang , Byeongchan Kim , Solji Song , Chungsun Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2021-0117673 20210903
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L25/065

Abstract:
A semiconductor package includes a first semiconductor chip having a first substrate, a first insulating layer on the first substrate, and a plurality of first bonding pads on the first insulating layer, and having a flat upper surface by an upper surface of the first insulating layer and upper surfaces of the plurality of first bonding pads; and a second semiconductor chip on the upper surface of the first semiconductor chip and having a second substrate, a second insulating layer below the second substrate and in contact with the first insulating layer, and a plurality of second bonding pads on the second insulating layer and in contact with the first bonding pads, respectively, wherein the first insulating layer includes an insulating interfacial layer in contact with the second insulating layer, embedded in the first insulating layer, and spaced apart from the plurality of first bonding pads.
Public/Granted literature
- US20230070532A1 SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2023-03-09
Information query
IPC分类: