Invention Grant
- Patent Title: Plasma processing apparatus
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Application No.: US18058989Application Date: 2022-11-28
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Publication No.: US12205799B2Publication Date: 2025-01-21
- Inventor: Isao Gunji , Hiroyuki Miyashita
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Armstrong Teasdale LLP
- Priority: JP2021-197596 20211206
- Main IPC: H01J37/32
- IPC: H01J37/32

Abstract:
A plasma processing apparatus includes: a processing container; a ceiling wall forming a part of the processing container and including an opening; and a transmission window configured to close the opening, wherein the opening under the transmission window is formed as a recess portion, wherein the recess portion is a supply port for supplying electromagnetic waves from the transmission window into the processing container, wherein first gas supply holes are formed on a lower surface of the ceiling wall, and wherein second gas supply holes are formed on an inner surface of the recess portion.
Public/Granted literature
- US20230178340A1 PLASMA PROCESSING APPARATUS Public/Granted day:2023-06-08
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