Invention Grant
- Patent Title: Microreplicated polishing surface with enhanced co-planarity
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Application No.: US16636348Application Date: 2018-08-02
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Publication No.: US12208483B2Publication Date: 2025-01-28
- Inventor: Kenneth A. P. Meyer , John J. Sullivan , Brian W. Lueck , Duy K. Lehuu , David J. Muradian , David F. Slama
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN St. Paul
- Agent Jonathan L. Tolstedt
- International Application: PCT/IB2018/055815 WO 20180802
- International Announcement: WO2019/026021 WO 20190207
- Main IPC: B24B37/26
- IPC: B24B37/26 ; B24B37/22 ; B24B37/24 ; B24D3/28 ; B24D11/00 ; B29L31/00 ; H01L21/304 ; H01L21/306

Abstract:
An article includes a polishing layer that includes a plurality of raised cells separated by a plurality of channels. Each of the plurality of raised cells includes a microstructured working surface, a substantially vertical channel surface, and an offset surface between an edge of the working surface and an upper edge of the channel surface. The microstructured working surface includes a plurality of microstructures. Tops of the plurality of microstructures define a top plane and bases of the plurality of microstructures define a base plane. The substantially vertical channel surface defines a wall of a channel of the plurality of channels and the channel surface defines a channel plane. The offset surface includes a nonplanar portion of displaced material. The displaced material defines a displacement plane that is below the base plane or within a tolerance of the top plane.
Public/Granted literature
- US20200164484A1 MICROREPLICATED POLISHING SURFACE WITH ENHANCED CO-PLANARITY Public/Granted day:2020-05-28
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