Polishing pads and systems and methods of making and using the same

    公开(公告)号:US10071461B2

    公开(公告)日:2018-09-11

    申请号:US15300125

    申请日:2015-03-31

    Abstract: The present disclosure relates to polishing pads which include a polishing layer, wherein the polishing layer includes a working surface and a second surface opposite the working surface. The working surface includes a plurality of precisely shaped pores, a plurality of precisely shaped asperities and a land region. The present disclosure further relates to a polishing system, the polishing system includes the preceding polishing pad and a polishing solution. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution.

    Polishing pads and systems and methods of making and using the same

    公开(公告)号:US10252396B2

    公开(公告)日:2019-04-09

    申请号:US15129639

    申请日:2015-03-31

    Abstract: The present disclosure relates to polishing pads which include a polishing layer, wherein the polishing layer includes a working surface and a second surface opposite the working surface. The working surface includes at least one of a plurality of precisely shaped pores and a plurality of precisely shaped asperities. The present disclosure further relates to a polishing system, the polishing system includes the preceding polishing pad and a polishing solution. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution.

    FORCE-SENSING CAPACITOR ELEMENTS, DEFORMABLE MEMBRANES AND ELECTRONIC DEVICES FABRICATED THEREFROM

    公开(公告)号:US20180032181A1

    公开(公告)日:2018-02-01

    申请号:US15727922

    申请日:2017-10-09

    CPC classification number: G06F3/044 G01L1/142 G01L1/146 G01L5/165 G06F3/0414

    Abstract: Force-sensing capacitor elements and deformable membranes useful in electronic devices that include touch screen displays or other touch sensors. The deformable membranes, generally, include a first, second, and third layers with a first arrangement of a plurality of first structures interposed between the first and third layers and a second arrangement of one or more second structures interposed between the second and third layers. Electrodes may be included proximate to or in contact with one or more of the major surfaces of the first, second, and third layers or embedded within one or more of the second and third layers of the deformable membranes, yielding force-sensing capacitor elements. The electrodes proximate to or in contact with the one or more of the major surfaces of the first and second layers or embedded within one or more of the second and third layers may be one or more plurality of electrodes.

    FORCE-SENSING CAPACITOR ELEMENTS, DEFORMABLE MEMBRANES AND ELECTRONIC DEVICES FABRICATED THEREFROM

    公开(公告)号:US20170177114A1

    公开(公告)日:2017-06-22

    申请号:US15325637

    申请日:2015-08-06

    CPC classification number: G06F3/044 G01L1/142 G01L1/146 G01L5/165 G06F3/0414

    Abstract: Force-sensing capacitor elements and deformable membranes useful in electronic devices that include touch screen displays or other touch sensors. The deformable membranes, generally, include a first, second, and third layers with a first arrangement of a plurality of first structures interposed between the first and third layers and a second arrangement of one or more second structures interposed between the second and third layers. Electrodes may be included proximate to or in contact with one or more of the major surfaces of the first, second, and third layers or embedded within one or more of the second and third layers of the deformable membranes, yielding force-sensing capacitor elements. The electrodes proximate to or in contact with the one or more of the major surfaces of the first and second layers or embedded within one or more of the second and third layers may be one or more plurality of electrodes.

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