Invention Grant
- Patent Title: MEMS probe card
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Application No.: US18021244Application Date: 2021-07-27
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Publication No.: US12222369B2Publication Date: 2025-02-11
- Inventor: Liangyu Zhao , Ailin Wang
- Applicant: MAXONE SEMICONDUCTOR CO., LTD.
- Applicant Address: CN Jiangsu
- Assignee: MAXONE SEMICONDUCTOR CO., LTD.
- Current Assignee: MAXONE SEMICONDUCTOR CO., LTD.
- Current Assignee Address: CN Jiangsu
- Agency: Oliff PLC
- Priority: CN202010816387.3 20200814
- International Application: PCT/CN2021/108720 WO 20210727
- International Announcement: WO2022/033300 WO 20220217
- Main IPC: G01R31/20
- IPC: G01R31/20 ; G01R1/073

Abstract:
The MEMS probe card of the invention belongs to the technical field of IC manufacturing industry, and specifically relates to the manufacturing of micro-electromechanical systems, testing of semiconductor bare chip and related key technologies; From top to bottom, the probe card comprises a stiffener, a PCB board, an adapter layer, a guide plate and a MEMS probe; the invention not only discloses a MEMS probe card, but also discloses a new manufacturing process of a MEMS probe card, including the structure of MEMS probe card, the etching equipment and method of guide plate-MEMS probe structure template, the probe positioning method of etching the guide plate-MEMS probe structure template, the manufacturing method of the guide plate-MEMS probe structure and the docking device and method of the guide plate-MEMS probe structure and the adapter layer to finally realize the manufacturing of a submicron-sized MEMS probe card.
Public/Granted literature
- US20230324437A1 MEMS PROBE CARD Public/Granted day:2023-10-12
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