An electronic device includes a housing and a first heat source, a second heat source, and a heat dissipation module that are disposed in the housing. The heat dissipation module includes a first fan, a second fan, a first heat conduction member, and a second heat conduction member. The first fan and the second fan are disposed on two opposite sides of the housing. One end of the first heat conduction member is disposed at the first fan, and the other end is located at a position on a side of an upper surface of the housing corresponding to the first heat source. One end of the second heat conduction member is disposed at the second fan, and the other end is located on a side of a lower surface of the housing and abuts against the second heat source.