Invention Grant
- Patent Title: Plating apparatus for plating semiconductor wafer and plating method
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Application No.: US18152089Application Date: 2023-01-09
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Publication No.: US12227867B2Publication Date: 2025-02-18
- Inventor: Chen-Yu Tsai , Ku-Feng Yang , Wen-Chih Chiou
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: C25D21/04
- IPC: C25D21/04 ; C25D7/12 ; C25D17/00 ; C25D17/08 ; C25D21/10 ; H01L21/768
Abstract:
A plating apparatus includes a workpiece holder, a plating bath, and a clamp ring. The plating bath is underneath the workpiece holder. The clamp ring is connected to the workpiece holder. The clamp ring includes channels communicating an inner surface of the clamp ring and an outer surface of the clamp ring.
Public/Granted literature
- US20230142163A1 PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD Public/Granted day:2023-05-11
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