Invention Grant
- Patent Title: Flexible hybrid electronic substrate and electronic textile including the same
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Application No.: US17585574Application Date: 2022-01-27
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Publication No.: US12232256B2Publication Date: 2025-02-18
- Inventor: I-Hung Chiang , Hung-Hsien Ko , Min-Hsiung Liang , Te-Hsun Lin , Chen-Tsai Yang , Hao-Wei Yu
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW110141472 20211108
- Main IPC: H05K1/02
- IPC: H05K1/02 ; A61B5/00 ; H05K1/03 ; H05K3/32

Abstract:
A flexible hybrid electronic substrate and electronic textile including the same are provided. The flexible hybrid electronic substrate includes a first region and a second region. There is a joint between the first region and the second region. Each of the first region and the second region includes at least one selected from the group consisting of the following structure features: multilayer structure feature, anisotropic structure feature and pre-strained structure feature.
Public/Granted literature
- US20230147556A1 FLEXIBLE HYBRID ELECTRONIC SUBSTRATE AND ELECTRONIC TEXTILE INCLUDING THE SAME Public/Granted day:2023-05-11
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