Disclosed is an electronic device including a cover defining a portion of an external appearance of the electronic device, a film layer attached to a first surface of the cover, at least one UV molding pattern layer disposed on the film layer, wherein the at least one UV molding pattern layer includes a first area, and a second area that is different from the first area, a thermally cured printing layer disposed on the first area of the at least one UV molding pattern layer, and a deposition layer including a first part disposed to overlap the first area of the at least one UV molding pattern layer, and a second part disposed in the second area of the at least one UV molding pattern layer.