Invention Grant
- Patent Title: Package for an integrated circuit and manufacturing method
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Application No.: US18630676Application Date: 2024-04-09
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Publication No.: US12249549B2Publication Date: 2025-03-11
- Inventor: Jerome Lopez
- Applicant: STMicroelectronics (Grenoble 2) SAS
- Applicant Address: FR Grenoble
- Assignee: STMicroelectronics (Grenoble 2) SAS
- Current Assignee: STMicroelectronics (Grenoble 2) SAS
- Current Assignee Address: FR Grenoble
- Agency: Crowe & Dunlevy LLC
- Priority: FR2011727 20201116
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/10 ; H01L23/12 ; H01L33/52

Abstract:
An encapsulation hood is fastened onto electrically conductive zones of a support substrate using springs. Each spring has a region in contact with an electrically conductive path contained in the encapsulation hood and another region in contact with a corresponding one of the electrically conductive zones. The fastening of the part of the encapsulation hood onto the support substrate compresses the springs and further utilizes a bead of insulating glue located between the compressed springs.
Public/Granted literature
- US20240258184A1 PACKAGE FOR AN INTEGRATED CIRCUIT AND MANUFACTURING METHOD Public/Granted day:2024-08-01
Information query
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