公开(公告)号：US12249549B2

公开(公告)日：2025-03-11

申请号：US18630676

申请日：2024-04-09

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Jerome Lopez

IPC: H01L23/31 ,  H01L23/10 ,  H01L23/12 ,  H01L33/52

Abstract: An encapsulation hood is fastened onto electrically conductive zones of a support substrate using springs. Each spring has a region in contact with an electrically conductive path contained in the encapsulation hood and another region in contact with a corresponding one of the electrically conductive zones. The fastening of the part of the encapsulation hood onto the support substrate compresses the springs and further utilizes a bead of insulating glue located between the compressed springs.

公开(公告)号：US10292259B2

公开(公告)日：2019-05-14

申请号：US15142213

申请日：2016-04-29

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Laurent Marechal ,  Richard Rembert ,  Jerome Lopez

IPC: H02K1/02 ,  H05K1/02

Abstract: An electronic device disclosed herein includes a first conductor layer, a first nonconducting layer, and a second conductor layer in a stacked arrangement. A signal carrying conductive via is formed in the first nonconducting layer and extends between the first conductor layer and the second conductor layer. A shielding conductive via is formed in the first nonconducting layer, is not electrically coupled to the signal carrying conductive via, and substantially completely surrounds the signal carrying conductive via in spaced apart relation thereto.

公开(公告)号：US10224306B2

公开(公告)日：2019-03-05

申请号：US15602278

申请日：2017-05-23

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： David Auchere ,  Asma Hajji ,  Fabien Quercia ,  Jerome Lopez

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/31

Abstract: An electrical connection wire connects an electrical connection pad of an electrical chip and an electrical connection pad of a carrier substrate to which the electronic chip is mounted. A dielectric layer surrounds at least the bonding wire. The dielectric layer may be a dielectric sheath or a hardened liquid dielectric material. A dielectric material may also cover at least a portion of the electrical chip and carrier substrate. A liquid electrically conductive material is deposited and hardened to form a local conductive shield surrounding the dielectric layer at the bonding wire.

公开(公告)号：US20180122770A1

公开(公告)日：2018-05-03

申请号：US15602278

申请日：2017-05-23

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： David Auchere ,  Asma Hajji ,  Fabien Quercia ,  Jerome Lopez

IPC: H01L23/00 ,  H01L23/552 ,  H01L23/31

CPC classification number: H01L24/85 ,  H01L23/3157 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/48992 ,  H01L2224/48997 ,  H01L2224/8592

Abstract: An electrical connection wire connects an electrical connection pad of an electrical chip and an electrical connection pad of a carrier substrate to which the electronic chip is mounted. A dielectric layer surrounds at least the bonding wire. The dielectric layer may be a dielectric sheath or a hardened liquid dielectric material. A dielectric material may also cover at least a portion of the electrical chip and carrier substrate. A liquid electrically conductive material is deposited and hardened to form a local conductive shield surrounding the dielectric layer at the bonding wire.

公开(公告)号：US12218287B2

公开(公告)日：2025-02-04

申请号：US18503025

申请日：2023-11-06

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Olivier Zanellato ,  Remi Brechignac ,  Jerome Lopez

IPC: H01L33/48 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/00

Abstract: The present description concerns a package for an electronic device. The package including a plate and a lateral wall, separated by a layer made of a bonding material and at least one region made of a material configured to form in the region an opening between the inside and the outside of the package when the package is heated.

公开(公告)号：US11862757B2

公开(公告)日：2024-01-02

申请号：US17485010

申请日：2021-09-24

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Olivier Zanellato ,  Remi Brechignac ,  Jerome Lopez

IPC: H01L33/48 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/00

CPC classification number: H01L33/483 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/005

Abstract: The present description concerns a package for an electronic device. The package including a plate and a lateral wall, separated by a layer made of a bonding material and at least one region made of a material configured to form in the region an opening between the inside and the outside of the package when the package is heated.

公开(公告)号：US20170318664A1

公开(公告)日：2017-11-02

申请号：US15142213

申请日：2016-04-29

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Laurent Marechal ,  Richard Rembert ,  Jerome Lopez

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/42 ,  H05K3/10

CPC classification number: H05K1/0251 ,  H05K1/0222

Abstract: An electronic device disclosed herein includes a first conductor layer, a first nonconducting layer, and a second conductor layer in a stacked arrangement. A signal carrying conductive via is formed in the first nonconducting layer and extends between the first conductor layer and the second conductor layer. A shielding conductive via is formed in the first nonconducting layer, is not electrically coupled to the signal carrying conductive via, and substantially completely surrounds the signal carrying conductive via in spaced apart relation thereto.

公开(公告)号：US12170262B2

公开(公告)日：2024-12-17

申请号：US18081884

申请日：2022-12-15

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： David Auchere ,  Asma Hajji ,  Fabien Quercia ,  Jerome Lopez

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/552

Abstract: An electrical connection wire connects an electrical connection pad of an electrical chip and an electrical connection pad of a carrier substrate to which the electronic chip is mounted. A dielectric layer surrounds at least the bonding wire. The dielectric layer may be a dielectric sheath or a hardened liquid dielectric material. A dielectric material may also cover at least a portion of the electrical chip and carrier substrate. A liquid electrically conductive material is deposited and hardened to form a local conductive shield surrounding the dielectric layer at the bonding wire.

公开(公告)号：US11984373B2

公开(公告)日：2024-05-14

申请号：US17522327

申请日：2021-11-09

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Jerome Lopez

IPC: H01L23/31 ,  H01L23/10 ,  H01L23/12 ,  H01L33/52 ,  H01S5/02218 ,  H01S5/068

CPC classification number: H01L23/3114 ,  H01L23/10 ,  H01L23/12 ,  H01L33/52

Abstract: An encapsulation hood is fastened onto electrically conductive zones of a support substrate using springs. Each spring has a region in contact with an electrically conductive path contained in the encapsulation hood and another region in contact with a corresponding one of the electrically conductive zones. The fastening of the part of the encapsulation hood onto the support substrate compresses the springs and further utilizes a bead of insulating glue located between the compressed springs.

公开(公告)号：US11557566B2

公开(公告)日：2023-01-17

申请号：US16835793

申请日：2020-03-31

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： David Auchere ,  Asma Hajji ,  Fabien Quercia ,  Jerome Lopez

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/552

Abstract: An electrical connection wire connects an electrical connection pad of an electrical chip and an electrical connection pad of a carrier substrate to which the electronic chip is mounted. A dielectric layer surrounds at least the bonding wire. The dielectric layer may be a dielectric sheath or a hardened liquid dielectric material. A dielectric material may also cover at least a portion of the electrical chip and carrier substrate. A liquid electrically conductive material is deposited and hardened to form a local conductive shield surrounding the dielectric layer at the bonding wire.