Invention Grant
- Patent Title: Semiconductor devices having parasitic channel structures
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Application No.: US17447099Application Date: 2021-09-08
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Publication No.: US12249623B2Publication Date: 2025-03-11
- Inventor: Yu-Cheng Shen , Guan-Jie Shen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L21/8234 ; H01L29/06 ; H01L29/66 ; H01L29/78 ; H01L29/786

Abstract:
The present disclosure describes a semiconductor device and methods for forming the same. The semiconductor device includes nanostructures on a substrate and a source/drain region in contact with the nanostructures. The semiconductor device also includes a gate structure that includes first and second portions. The first portion is formed between each nanostructure of nanostructures. The second portion is formed under the bottom-most nanostructure of the plurality of nanostructures and extends under a top surface of the substrate.
Public/Granted literature
- US20220336585A1 SEMICONDUCTOR DEVICES HAVING PARASITIC CHANNEL STRUCTURES Public/Granted day:2022-10-20
Information query
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