Invention Grant
- Patent Title: Electrostatic chuck assembly for plasma processing apparatus
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Application No.: US18654429Application Date: 2024-05-03
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Publication No.: US12261073B2Publication Date: 2025-03-25
- Inventor: Maolin Long
- Applicant: Beijing E-Town Semiconductor Technology Co., Ltd. , Mattson Technology, Inc.
- Applicant Address: CN Beijing; US CA Fremont
- Assignee: Beijing E-Town Semiconductor Technology Co., Ltd.,Mattson Technology, Inc.
- Current Assignee: Beijing E-Town Semiconductor Technology Co., Ltd.,Mattson Technology, Inc.
- Current Assignee Address: CN Beijing; US CA Fremont
- Agency: Dority & Manning, P.A.
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01J37/32 ; H01L21/683
Abstract:
An electrostatic chuck including a workpiece support surface, clamping layer, heating layer, thermal control system, and sealing band is disclosed. The sealing band surrounds an outer perimeter of the electrostatic chuck including at least a portion of the workpiece surface. The sealing band has a width greater than about 3 millimeters (mm) up to about 10 mm. Plasma processing apparatuses and systems incorporating the electrostatic chuck are also provided.
Public/Granted literature
- US20240282614A1 Electrostatic Chuck Assembly for Plasma Processing Apparatus Public/Granted day:2024-08-22
Information query
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