Invention Grant
- Patent Title: Coupling systems and methods of use thereof
-
Application No.: US17378292Application Date: 2021-07-16
-
Publication No.: US12285808B2Publication Date: 2025-04-29
- Inventor: Om Prakash , Sandeep Tripathi , Megha Sahu , Kamaraj Kandhasamy , Carolyn L. Kupper
- Applicant: THE BOEING COMPANY
- Applicant Address: US IL Chicago
- Assignee: THE BOEING COMPANY
- Current Assignee: THE BOEING COMPANY
- Current Assignee Address: US IL Chicago
- Agency: Yee & Associates, P.C.
- Main IPC: B23B31/30
- IPC: B23B31/30 ; B08B9/027 ; B23Q3/06 ; B08B9/032

Abstract:
The present disclosure provides coupling systems for use in industrial systems to removably couple one or more components to the industrial system. The coupling systems discussed herein employ a flexible sleeve in addition to one or more components. The flexible sleeve can have a component disposed therein. When pressure is applied to the flexible sleeve, the flexible sleeve constricts around the component, securing the component in the coupling system and thus to the industrial system. Once the component is secured, the industrial system executes one or more processes on the component. The coupling systems discussed herein can accommodate components of varying internal and external geometries as well as internal and/or external coatings and surface finishes.
Public/Granted literature
- US20220056930A1 COUPLING SYSTEMS AND METHODS OF USE THEREOF Public/Granted day:2022-02-24
Information query