Invention Grant
- Patent Title: LED chip and manufacturing method of the same
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Application No.: US18111861Application Date: 2023-02-20
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Publication No.: US12288775B2Publication Date: 2025-04-29
- Inventor: Jong Min Jang , Chang Yeon Kim , Myoung Hak Yang
- Applicant: SEOUL VIOSYS CO., LTD.
- Applicant Address: KR Ansan-si
- Assignee: SEOUL VIOSYS CO., LTD.
- Current Assignee: SEOUL VIOSYS CO., LTD.
- Current Assignee Address: KR Ansan-si
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L25/075
- IPC: H01L25/075 ; H01L23/31 ; H01L27/15 ; H01L33/62

Abstract:
A light emitting device including a board, a first stacked structure configured to emit light having a first wavelength, a second stacked structure configured to emit light having a second wavelength, a third stacked structure configured to emit light having a third wavelength, a first connection electrode electrically connected to the first stacked structure, the second stacked structure, and the third stacked structure, and a protection material covering at least a portion of the first connection electrode, in which each of the first, second, and third stacked structures is configured to selectively emit light while being connected to the first connection electrode, and the protection material is configured to transmit at least 50% of light having the first wavelength, light having the second wavelength, and light having the third wavelength upon operation of each of the first, second, and third stacked structures.
Public/Granted literature
- US20230207538A1 LED CHIP AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2023-06-29
Information query
IPC分类: