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US12292661B2 Electronic devices including transfer layer, methods of manufacturing the electronic devices, and electronic apparatuses including the electronic devices 有权

Electronic devices including transfer layer, methods of manufacturing the electronic devices, and electronic apparatuses including the electronic devices
Abstract:
An electronic device including a transfer layer, a method of manufacturing the electronic device, and an electronic apparatus including the electronic device are provided. The electronic device includes a substrate having a thickness less than 0.7 mm; a first transfer layer provided on a first surface of the substrate, the first transfer layer including an organic material; and a first stack provided on the first transfer layer.
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