Invention Grant
- Patent Title: Gate-all-around integrated circuit structures having insulator substrate
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Application No.: US16727370Application Date: 2019-12-26
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Publication No.: US12294006B2Publication Date: 2025-05-06
- Inventor: Chung-Hsun Lin , Biswajeet Guha , William Hsu , Stephen Cea , Tahir Ghani
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/84 ; H01L27/12 ; H01L29/06 ; H01L29/08 ; H01L29/66 ; H01L29/78

Abstract:
Gate-all-around integrated circuit structures having an insulator substrate, and methods of fabricating gate-all-around integrated circuit structures having an insulator substrate, are described. For example, an integrated circuit structure includes a semiconductor fin on an insulator substrate. A vertical arrangement of horizontal nanowires is over the semiconductor fin. A gate stack surrounds a channel region of the vertical arrangement of horizontal nanowires, and the gate stack is overlying a channel region of the semiconductor fin. A pair of epitaxial source or drain structures is at first and second ends of the vertical arrangement of horizontal nanowires and the semiconductor fin.
Public/Granted literature
- US20210202534A1 GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING INSULATOR SUBSTRATE Public/Granted day:2021-07-01
Information query
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